发明名称 WIRE BONDING EQUIPMENT
摘要 PURPOSE:To increase position precision by retaining a bonding tool vertically by using a parallel link mechanism. CONSTITUTION:A tool 5 is installed at the tip of a block 6, which is retained by a parallel link 7 and can move up and down. The parallel link 7 retaining the tool 5 is installed at the lower end part of a vertical shaft 9, which is engaged with a linear motion cam capable of rotary driving by an AC servomotor 10 installed at the upper part of the shaft, and moves up and down in proportion to the rotation angle of the AC servomotor 10. A wire 3 is pressed against a part to be bonded, and a current is applied to the wire 3 by two electrodes formed at the tip of the bonding tool 5. The wire 3 is bonded to the surface to be bonded by heat. Thus the bonding tool is retained by using the parallel link mechanism and moved up and down, so that stable bonding of superior position precision is realized.
申请公布号 JPH0350749(A) 申请公布日期 1991.03.05
申请号 JP19890185550 申请日期 1989.07.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMURA SHINYA;YAMAMOTO AKIHIRO;MAKINO YUTAKA;HIRANO MASATO
分类号 H01L21/60 主分类号 H01L21/60
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