Vapor reflow type soldering apparatus with an improved flux separating unit

摘要

A vapor reflow type soldering apparatus comprising a tank that is filled with saturated vapor of a heat medium and a passage extending through the tank. An article to be processed is transferred through the passage and is brought into contact with the saturated vapor so that a solder material on the article is heated and molten. Also, a discharge gas collecting unit is provided in the apparatus and includes a chilled water system through which water at a constant temperature is caused to flow. The heat medium is collected out of the discharge gas from the apparatus and is returned back to a tank. A flux separating unit is connected to the chilled water system of the discharge gas unit through a pipes and switching valves. The chilled water in the chilled water system is selectively introduced into the flux separating unit to cool the heat medium within the tank, and a flux molten into the heat medium is removed from the molten solder material.