| 摘要 |
<p>PURPOSE:To prevent a bad influence on a semiconductor element by generated heat and to enhance a close contact force between a resin and a lead frame by forming a window part at an inner lead part by a method wherein a die stage part of the lead frame and the inner lead part in one part are connected and united. CONSTITUTION:Inner lead parts 4 which are faced with the central part of long sides are connected to a die stage part 3 and these are formed collectively; window parts 12 are formed in its neighborhood. The die stage part 3 is formed in such a way that a difference in level is formed with reference to the inner lead parts 4 and tie bars 6, 6'. A semiconductor element 9 is mounted on the die stage part 3; its electrodes and the inner lead parts 4 are connected by using wires 10; after that, this assembly is molded and sealed by using a resin 11 so as to wrap the die stage part 3 and the inner lead parts 4. After that, individual tie bars 2, 2', 7, 7', 8, 8' are cut and removed; in addition, outer lead parts 5 are bent and shaped. Thereby, heat generated at the semiconductor element 9 is dissipated to the outside of a package; the window parts 12 enhance a close contact force because they are connected to resins on the surface and the rear.</p> |
