首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METAL MOLD APPARATUS FOR SEMICONDUCTOR RESIN SEALING
摘要
申请公布号
JPH0350841(A)
申请公布日期
1991.03.05
申请号
JP19890186636
申请日期
1989.07.19
申请人
TOSHIBA CORP
发明人
SHINDO MASAMICHI
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
您可能感兴趣的专利
METHOD AND APPARATUS FOR DETECTING AIRBORNE ALLERGEN PARTICULATES.
METHODS FOR RUGGED ATTACHMENT OF FIBERS TO INTEGRATED OPTICS CHIPS AND PRODUCT THEREOF.
Sausage link handling and packaging machine.
Apparatus for forming and driving staples.
Amperometric detection cell.
Enhancement of gold lixiviation using nitrogen and sulfur heterocyclic aromatic compounds
HOLDOWN KEY FOR LOW PROFILE CONNECTOR.
CORRUGATED SHEET ASSEMBLY
VERTIKALNA TRAKASTA TESTERA
HIGH MODULUS CARBON AND GRAPHITE ARTICLES AND METHOD FOR THEIR PREPARATION.
Kvanterad koherent RAKE-mottagare
SYSTEM FOR MANAGING A PLURALITY OF COMPUTER JUKEBOXES.
ANTI-VIRAL FUSION PEPTIDES.
POLYMERS AND POLYMER BLENDS MODIFIED WITH POLY(PHENYLENE ETHER).
TOPICAL COMPOSITIONS CONTAINING STEROIDS.
ANTIVIRAL ACYCLIC PHOSPHONOMETHOXYALKYL SUBSTITUTED, ALKENYL AND ALKYNYL PURINE AND PYRIMIDINE DERIVATIVES.
TISSUE IRRIGATING SOLUTION.
PLEATED POLY(TETRA-FLUORO ETHYLENE) FILTER MEDIUM AND SUPPORT.
NOZZLE FOR DISCHARGING AIR AND METHOD.
HETEROALKOXY BENZAZEPINES.
