| 摘要 |
PURPOSE:To improve the conductivity of a screen-printed circuit by using a printed circuit composed of conductive paste as an internal layer and hot- pressing the whole. CONSTITUTION:A circuit board for an external layer is arranged and superposed on at least one surface through an insulating base material in one or more of internal-layer circuit boards formed by printing conductive paste on one surface or both surfaces and curing conductive paste in the insulating base material, and the whole is thermocompression-bonded and unified through a hot-press method. The mutual contacts of metallic powder are improved considerably on hot-press, but a resin can be moved extremely easily when a thermoplastic resin is used as the resin interposed among metallic powder, thus bringing mutual contacts among metallic powder to a state close to an ideal state from the viewpoint of conductivity. |
