发明名称 |
RUBBER CHIP TILE, PREPARATION AND EXECUTION THEREOF |
摘要 |
<p>PURPOSE:To easily and inexpensively prepare a rubber chip tile according to a mass production system by providing a heat-meltable adhesive layer to the single surface of a rubber chip molded plate and applying a heat-meltable film to the surface of said adhesive layer. CONSTITUTION:A heat meltable adhesive layer 2 is provided to the single sur face of a rubber chip molded plate 1 and a heat-meltable film 3 is bonded to the surface of said adhesive layer 2. Pref., by interposing a primer 4 between the rubber chip molded plate 1 and the heat-meltable adhesive layer 2, the heat-meltable adhesive layer 2 is strongly bonded to the rubber chip molded plate 1 and a stable and strong rubber chip tile P is obtained. The rubber chip molded plate 1 is formed by pressing a mixture prepared by mixing a proper amount of a curable resin (b) with the mass (group) of rubber chips (a) as a binder to cure and mold the same in a predetermined compressed state and, as the rubber chips mass, one composed of particles having a particle size of about 1-3mm prepared by finely pulverizing an old tire is pref. used. As the binder, a moistur-curable polyurethane resin, a liquid polybutadiene resin and an epoxy resin are used.</p> |
申请公布号 |
JPH0349947(A) |
申请公布日期 |
1991.03.04 |
申请号 |
JP19890183895 |
申请日期 |
1989.07.17 |
申请人 |
NISSHIN KOGYO KK;SHIN NIPPON KAKO KK |
发明人 |
TANABE SHUHEI;SEKIHARA KATSUAKI;OZEKI HAJIME;TAKEUCHI YASUKANE |
分类号 |
B32B25/04;B32B7/02;B32B7/12;B32B11/04;B32B27/08;B32B37/10;C09J5/06;E01C5/22;E04F15/10 |
主分类号 |
B32B25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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