发明名称 HEAT TREATMENT DEVICE
摘要 <p>PURPOSE:To manufacture the title heat-treatment device capable of leading-in wokpieces while miniaturizing and simplifying the structure of a shifting device to shift wafers as well as for reducing any raised dust by a method wherein, when the wokpieces are carried in and out of the device, a cdrrying in and out mechanism alternately changing the containing direction of the wokpieces in the vertical and horizontal state is provided. CONSTITUTION:The title heat treatment device wherein a processing boat 10 containing workpieces 3 is loaded onto a heat treatment furnace is provided with a carrying and out mechanism alternately changing the containing direction of the workpieces 3 in the vertical and horizontal states. For example, a wafer carrier 7 carried to a carrying in and out boat 10 is held by clamps 31a, 31b while a base 30 is turned downward centered on a rotary axle 33 to fix the position. Next, carrier holding arms 37a, 37b are horizontally shifted to hold the sides of the wafer carrier 7 by carrier holder provided on the ends of the said arms 37a, 37b and then the clamps 31a, 31b are released. Finally, the carrier holding arms 37a, 37b are horizontally shifted to the device main body side to retract the wafer carrier 7 in the device.</p>
申请公布号 JPH0348438(A) 申请公布日期 1991.03.01
申请号 JP19890183929 申请日期 1989.07.17
申请人 TOKYO ELECTRON SAGAMI LTD 发明人 IWAI HIROYUKI
分类号 H01L21/677;H01L21/68 主分类号 H01L21/677
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