| 摘要 |
<p>PURPOSE:To obtain the high adhesive strength by low temperature burning and the fine soldering wettability and while reduce the manufacture costs by mixing the predetermined quantity of respective solid component which consists of glass powder including the predetermined quantity of PbO or the like and Cu powder and vehicle component to knead them. CONSTITUTION:The glass powder which consists of PbO: 40-75 weight %, B2O3:10-20 weight %, SiO: 4-20weight% and ZnO: 2-20weight% is used. Solid component which consists of this glass powder:2-15% and the residual part including, at least, one of Cu powder or less than 10% of Ag-Cu compound powder including Cu powder and 0.5-20% of Ag or less than 5% of Ti powder is used. 20-10% of vehicle component is added to 80-90% of this solid component to be kneaded. Cu powder including less than 10% of Cu2O powder can be used as the residual part of the solid component, except the glass powder. The copper paste obtained in this way has the fine adhesive strength even if it is burned at low temperature less than 900 deg.C.</p> |
