| 摘要 |
PURPOSE:To concurrently perform cutting work and inspection process, by providing ingot surface shape measuring, cutter rotary condition detecting and wafer thickness measuring devices to the above described device of horizontal type cutting an ingot into wafers. CONSTITUTION:An ingot 1 is fed to a direction X at a prescribed pitch by a mounting part A, moved to a direction Y in a rotary part B and cut by a cutter blade 2. A cut wafer is stored in a storage case 19 through a receiving conveyer mechanism 4 after treatment of steps of cleaning, drying, etc. During the time of these operations in the above, there are inspected and measured a condition of the cutter blade 2 by an inspection device 5, supported to an arm 20, cut sectional shape of the ingot 1 by an inspection device 6 and thickness of the wafers by measuring devices 17, 18, respectively, when these three signals are integrated, if a rejected article is suspiciously generated, an alarm is displayed. |
