| 摘要 |
<p>A multilayer interconnection substrate (4) including signal layers (9), power supply layers (10), insulating layers (17) for electrically insulating the layers, and interconnecting paths (11,12,13,14). The signal layers, the power supply layers, and the insulating layers are superposed. Component connection terminals are mounted on a component mounting surface of the multilayer interconnection substrate for connecting to components. External connection terminals are mounted to another surface of the multilayer interconnection substrate. At least one power supply matching layer (8) is layered above both the signal layers and the power supply layers through a insulating layer and close to the component mounting surface. The power supply matching layer corresponds in voltage to a component to be mounted to the component mounting surface. The power supply matching layer is connected to corresponding component power supply terminals, corresponding power supply layers, and corresponding external power supply terminals through the interconnecting paths.</p> |
