发明名称 |
A COPPER-FOILED LAMINATED SHEET FOR FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
<p>The copper-foiled laminated sheet of the invention is used to prepare a printed circuit sheet having see-throughness after patterning by etching of the copper foil. Different from conventional copper-foiled laminates using an electrolytic copper foil having a surface roughness of 10 or larger, the inventive laminate is prepared using a rolled copper foil having a surface roughness of 1.5 to 5 so that the surface of the adhesive layer, from which the copper foil has been removed by etching, has no undue roughness as a replica of the copper foil surface not to irregularly diffuse the light giving a parallel light-beam transmission of at least 50% and overall light transmission of at least 70% to ensure good see-through visibility.</p> |
申请公布号 |
EP0223716(B1) |
申请公布日期 |
1991.02.27 |
申请号 |
EP19860402584 |
申请日期 |
1986.11.20 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
EGUCHI, YOSHITUGU;MIYASHITA, MASARU;ARAI, HITOSHI;OGUSHI, YOSHIMI |
分类号 |
H05K1/00;H05K1/02;H05K3/38 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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