| 摘要 |
<p>PURPOSE: To facilitate fabrication and increase the mounting area rate and effective wire diameter by comprising fragments, composed of conductor filaments to form specified connections and enclosure for keeping the positional stability of them. CONSTITUTION: A product for interconnecting various devices comprises a base 30 and conductor filaments 22, settled in an adhesive layer 26 in a first specified pattern and inner conductor layer adhered to one surface of the base. The filaments 22 are deformed, to extend up to the surface of the product from this layer. Fragments 24 form connections connecting the layers to a surface conductor layer having conductors in a second pattern corresponding to terminals of the devices, giving connection interface to the device. Enclosures 38, 48, 46 are provided for keeping the positional stability of intermediate conductor layers, the filaments 22 in the surface conductor layer and the filament fragments 24. This structure enables high-density wiring and short conductor paths.</p> |
