| 摘要 |
<p>PURPOSE:To transmit the normal input and output signals by extending die pads of a lead frame among inner leads in order to prolong a length of the inner leads and to shorten an interval of the inner leads. CONSTITUTION:When a semiconductor chip 4 sends or accepts signals to or from an external device through inner leads 2a and outer leads 2b, an extended lead 6 which is extended from a die pad and is arranged between the leads 2a is at the equal potential to the die pad. Then, a shieldining effect is produced and the interference among the signals generated between the leads 2a is removed. At this time, the lead 6 generates a shielding effect if a shape of the die pad is changed. By this lead 6; an IC package becomes to have a plurality of pins and the longer a length of the lead 2a is and the shorter an interval of leads 2a is, the more effectively a noise and a cross-talk phenomenon can be prevented. Thus, correct input and output signals can be transmitted to the outer leads 2b.</p> |
