发明名称 Solder pastes using alcohol blends as rheological aids
摘要 Solder paste vehicles using blends of monofunctional and polyfunctional alcohols are described. The blend may have a major portion of a low viscosity, monofunctional alcohol solvent and a minor portion of a high viscosity polyfunctional alcohol thickener. The monohydric solvent has a room temperature viscosity of at least 3 centipoise and from about 3 to 18 carbon atoms and may include such materials as 2-butanol, 1-hexanol, 1-heptanol, 1-octanol, 1-nonanol, 1-dodecanol, 2-ethoxyethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, n-hexadecanol, n-octadecanol, benzyl alcohol and mixtures thereof. The polyalcohol has a room temperature viscosity of between about 26 to about 1500 cp and includes compounds such as 1,2-ethanediol; 1,2-propanediol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 1,4-butanediol; 1,2-pentanediol; 1,5-pentanediol; 2,4-pentanediol; 2,5-hexane-diol; glycerol; 1,2,4-butanetriol; 2,2'-(ethylenedioxy)diethanol; 1,12-dodecane-diol; 1,16-hexanedecanediol and mixtures thereof. These blends give improved solubility of organic acid fluxing agents, provide relatively high viscosities of the solder paste and permit lower amounts of solvent to be used.
申请公布号 US4995921(A) 申请公布日期 1991.02.26
申请号 US19900521871 申请日期 1990.05.11
申请人 MOTOROLA, INC. 发明人 DAVIS, JAMES L.;PENNISI, ROBERT W.;NOUNOU, FADIA;LANDRETH, BOBBY D.
分类号 B23K35/36 主分类号 B23K35/36
代理机构 代理人
主权项
地址