| 摘要 |
<p>PURPOSE:To increase capacity and data processing speed and to enhance reliability by a method wherein the other end parts of the conductor leads bonded to the common electrode of a plurality of the memory LSI chips laminated to a printed wiring board are bonded to conductor wirings in a superposed state and also supported and connected by an insulating film. CONSTITUTION:Since the occupying area of memory LSI chips 6 are reduced by laminating two memory LSI chips 6 to mount the same on a printed wiring board 2 and a large number of the memory LSI chips 6 can be mounted on the printed wiring board 2 having a definite area, a large capacity IC memory card can be realized. Since the other end parts 12b, 12'b of the conductor leads of the common electrodes 10, 10' of the laminated memory LSI chips 6, 6' are connected to the conductor wirings 16 of the printed wiring board 2 in a superposed state, the IC memory card reduced in a wiring space and having fast signal transmitting speed can be realized. Since the other end parts 12b of the conductor leads are supported and connected by an insulating film 24, the soldering connection in the assembling process with the conductor wirings 16 becomes easy and the low cost IC memory card having high reliability can be realized.</p> |
