| 摘要 |
PURPOSE: To enhance connection reliability by providing hollow metal pipes and selecting interconnecting pads arranged in an array, corresponding to each of arrays of sensor contacts and read contacts with which the pipes are interconnected. CONSTITUTION: A hybrid infrared detector 10 comprises a read chip 14 and detector array 12, having 128×128 individual sensors 16. The chip 14 is a base for supporting pads of 0.001 square in., with a center-to-center spacing of 0.002 in. These pads have a thin cover layer having a multilayer structure of various contact metals which are Au-plated. Indium bumps are provided on connections opposite to the sensors 16 on pads 18. The detector and read chips 12, 14 are bonded by cold welding the In bumps on the oppositely arranged contact elements. The bump connections cannot be separated by an ordinary operation. |
