| 摘要 |
PURPOSE:To obtain a phenolic resin composition for laminated boards, consisting essentially of a phenolic resin and silicone-modified melamine resin and excellent in low temperature punchability, heat and moisture resistance. CONSTITUTION:A phenolic resin composition for laminated boards, obtained by cocondensing (B) a melamine resin (e.g. methylol group-containing melamine resin, methylol group-containing benzoquanamine resin or butyrated melamine resin) with a silicone resin (e.g. organosiloxanol or organoalkoxysilane) in a solvent, such as toluene, at 100-120 deg.C as shown in the formula, blending the resultant silicone-modified melamine resin in an amount so as to provide >=10wt.% amount thereof based on the total composition with (A) a phenolic resin (preferably a melamine-modified phenolic resin, oil-modified phenolic resin, etc.) and, as necessary, adding and blending a flame retardant and other components therewith and excellent in low-temperature punchability, heat and moisture resistance. |
