发明名称 STRUCTURE OF RESIST FILM OF THICK-FILM CIRCUIT BOARD
摘要 PURPOSE:To improve moisture resistance, and to reduce deterioration with time of insulating resistance by properly using a resist film formed by superposing a glass overcoat film and a bis maleimide-triazine (BT) coated film to conductor patterns in the direction of laminating or the direction of a surface. CONSTITUTION:A monolayer conductor pattern 12 including a crossover section 17, in which an insulator film 18 is interposed to crossing sections between conductor patterns, and a film element 13 such as a film resistor, a capacitor, etc., connected to the conductor pattern 12 are formed onto a ceramic board 11, and resist films 14 are applied. The resist films 14 are composed of the previously applied glass overcoat film 15 and the BT coated film 16 applied onto the film 15 on the surface of the surface-layer conductor pattern 12 of the conductor patterns containing the crossover section 17 and being approximately superposed in the direction of laminating and the film element 13 to be trimmed. When the upper section of the film element 13 to be trimmed is constituted only of the BT coated film 16, heat dissipation is lowered owing to an organic material, and there is possibility, in which heat is easy to be filled and the film element is melted, on trimming.
申请公布号 JPH0344092(A) 申请公布日期 1991.02.25
申请号 JP19890180091 申请日期 1989.07.11
申请人 FUJITSU LTD 发明人 KUMAI TOSHIO;TSUBONE KENICHIRO;TAKADA MICHIAKI
分类号 H05K3/28;H05K1/16;H05K3/46 主分类号 H05K3/28
代理机构 代理人
主权项
地址