| 摘要 |
<p>PURPOSE:To enable a solid image pick-up element chip previously assembled to be easily replaced without being damaged by a method wherein multiple solid image pick-up chips are respectively mounted on multiple chip carriers having longer side than those chips so that the said chips may be set in array on a package substrate using these chip carriers. CONSTITUTION:The lengths pf solid image pick-up element chips 10 and chip carriers 31 are adjusted so that the long side of the carriers 31 may become (X+alpha) mm when the length of the said chips 10 previously divided into chip state is specified to be Xmm. The bonding pads 12 on the said chips 10 and the terminals 32 on the chip carriers 31 are wire-bonded to one another by wires 13. Thus, an electric wiring is led out of the said chips 10 onto the chip carriers 31 so as to form an image pick-up unit 30. Successively, the terminals 32 on the chip carriers 31 and the terminals 22 on a package substrate 20 are wirebonded by the other wires 25. Finally, a glass cover 21 is fixed on the package substrate 20 using a bonding agent in an inert gas atmosphere such as nitrogen, etc., so as to seal up the loading atmosphere of the solid image pick-up element chips 10.</p> |
