TREATMENT TO REDUCE SOLDER PLATING WHISKER FORMATION

摘要

A method of inhibiting the formation of whiskers during solder plating of a copper base alloy material by electroplating said material in a methane sulfonate type solder bath. The method includes pretreating the alloy before electroplating. The pretreatment includes treating the alloy with a descale solution, a source of chromate ions in an acidic solution, or a passivation treatment with chromic acid, sulfuric acid, phosphoric acid and mixtures thereof.