发明名称 MANUFACTURE OF LEADFRAME
摘要 <p>PURPOSE:To avoid the deformation of inner leads by a method wherein a die pad is firmly fixed laminatedly on the end parts of the inner leads formed in the connected state leaving a connecting part through the intermediary of an insulating material. CONSTITUTION:After patterning a leadframe main body leaving a connecting part 30 (the first tie bar) connecting to inner leads 1, a die pad 4 separately formed from the leadframe main body is firmly fixed on the main body through the intermediary of an insulating material 5 and later, the connecting part 30 is cut off to isolate respective inner leads 1 from one another. That is, the die pad 4 is bonded onto the end parts of the patterned inner leads 1 in the least deformation state leaving the connecting part 30. Through these procedures, the deformation of the inner leads 1 can be avoided almost to perfection.</p>
申请公布号 JPH0338056(A) 申请公布日期 1991.02.19
申请号 JP19890173418 申请日期 1989.07.05
申请人 MITSUI HIGH TEC INC 发明人 MATSUBARA TOSHIYA;KUNIEDA AKIRA;MATSUBAYASHI HIDEAKI
分类号 H01L23/50 主分类号 H01L23/50
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