发明名称 AUTOMATIC SOLDERING MACHINE
摘要 The apparatus continuously performs soldering of printed circuit board (PCB) being inserted to the finger of a carrier, which moves up and down, forward and downward by two hydropneumatic cylinders, on a solder container. The apparatus includes a skimmer for removing oxidized coats, and for operating by a limit switch, and an elevator for feeding PCB through the lower apparatus body and returning PCB on the finger (conveying bracket) to the original position. The apparatus has inserting part, flux part, preheating part, soldering part, and conveying part.
申请公布号 KR910000999(B1) 申请公布日期 1991.02.19
申请号 KR19880005338 申请日期 1988.05.07
申请人 YU WON ENTERPRISE CO., LTD. 发明人 CHU KIL-WON
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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