| 摘要 |
<p>PURPOSE:To produce a tray with a good balance among the heat resistance, mechanical strengths, moldability, and electrical properties by injection molding a compsn. obtd. by compounding a specific polyphenylene ether polymer with a carbon black and an ethylene-acrylic ester copolymer. CONSTITUTION:100 pts.wt. polyphenylene ether resin comprising 58-96wt.% polyphenylene ether copolymer and 42-4wt.% polystyrene polymer is compounded with 10-40 pts.wt. carbon black and 5-20 pts.wt. ethylene-acrylic ester copolymer to give a resin compsn., which is injection molded to produce a tray for conveying semiconductor integrated circuits. To obtain a good balance between the impact strength of the tray and the moldability of the compsn., a pref. polystyrene polymer is in a range of from a high impact polystyrene resin contg. 2-7wt.% rubber to a mixture of the high impact polystyrene resin contg. a similar amt. of rubber with a transparent polystyrene resin.</p> |
