| 摘要 |
<p>PURPOSE:To allow a digital electronic circuit and an analog electronic circuit to coexist on a mother board and to raise connecting reliability of soldering by operating upper and lower conductor layers as a shielding layer used also as a power source layer, and raising the thermal resistance of a component connection part in the conductor layer to be soldered of a surface mounting component. CONSTITUTION:Upper and lower outer layer conductors 11, 12 cover the whole surface of a multilayer board except a part necessary for connection terminals of various electronic components, through holes, etc., as surface mounting components to be used also as a power source line. In this case, power source pads 32 as connection pads are so provided with a vacant part 33 therearound to increase its thermal resistance. Solder-plated Kovar conductor pin 4 is secured to a through hole 13 of a multilayer printed circuit board 1 by a high melting point solder dipping method to obtain a shielded printed wiring board for a surface mounting component.</p> |
