| 摘要 |
<p>PURPOSE:To prevent a tape from causing elongation and loosening when semiconductor wafers are laminated and dicing is performed by providing a radiation-curable self-adhesive layer on one face of a film-like supporting body consisting of specified two or more different resin layers. CONSTITUTION:A layer (a) consisting of a resin which is pref. a high density PE or PP with a density of 0.94g/cc and a crystallinity of 75% or higher and has a Vicat softening temp. of 120 deg.C or higher and a molding shrinkage of 0.5-3% and one or more layers (b) consisting of a resin different from the component (a) and a Shore hardness of 60 or lower and laminated to obtain a film-like supporting body (A) contg. at least a layer consisting of the component (a) and consisting of two or more different resin layers. Separately, 100 pts.wt. acrylic self-adhesive material (c), 5-500 pts.wt. cyanurate compd. with a C-C double bond and/or an isocyanurate compd. (d) and, if necessary, a photoinitiator, a polymn. promoter, a tackifier, a softening agent, an antioxidant, a pigment, etc., (e) are compounded to obtain a radiation-curable self-adhesive compsn. (B). One face of the component A is coated with a component B to form a radiation-curable self-adhesive layer with a thickness of 2-50mum.</p> |
