发明名称 |
KONTAKTFOERSEDD GIVARE MED SKIKTSTRUKTUR SAMT FOERFARANDE FOER UTFOERANDE AV KONTAKTERINGEN. |
摘要 |
In a novel multilayer transducer (1') with bonded contacts and a method for fabricating the bonded contact areas (5') of the transducer, the contact areas (5') are formed on the side surface (7) of the transducer by metal deposition using laser-based deposition, sputter deposition or another suitable metallization method. By virtue of the fabrication method of the contact areas, the size of the transducer (1')can be reduced and the transducer (1') can be bonded to a circuit board using surface-mount technology. |
申请公布号 |
FI893874(A) |
申请公布日期 |
1991.02.18 |
申请号 |
FI19890003874 |
申请日期 |
1989.08.17 |
申请人 |
VAISALA OY |
发明人 |
LEHTO, ARI;LAHDENPERAE, JUHA;KUISMA, HEIKKI |
分类号 |
H01L23/52;G01L9/00;G01L9/12;H01L21/3205;H01L21/78;H01L29/41;(IPC1-7):H01L/ |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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