| 摘要 |
<p>PURPOSE:To firmly mount electronic parts, and also, to improve the moisture proof by sealing a resin mold package IC onto a substrate with a potting resin in a state that it is mounted on the substrate. CONSTITUTION:Resin mold package ICs 33, 34, 35-1 and 35-2 provided adjacently to the lower face 31b of a substrate 31 are covered with an epoxy resin 120 brought to potting, and each resin mold package IC is sealed onto the substrate 31. In such a manner, even if respective ICs 33, 34, 35-1 and 35-2 receive heat at the time of reflow for solding and mounting a computer module 30 onto the substrate of a computer main body, and the soldering part of a lead 121 is melted temporarily, the disconnection of the lead 121 and a soldering bridge can be prevented. Also, the moisture proof in a mounting state to the substrate 31 can be improved.</p> |
