| 摘要 |
PURPOSE:To miniaturize a package by burying an electrode for external connection inside the side part of the surrounding case, in the conditions where the upper end projects above a surrounding case and the lower base fronts to the inside of the surrounding case, and connecting this lower base to a semiconductor chip through a metallic fine line. CONSTITUTION:Electrode terminals 12 and 13 are buried integrally in the base 11a and the frame 11b of the case in the conditions where the external connections 12b and 13b project above a case 11 and the topsides of inner connections 12a and 13a front to the inner bottoms of the case 11. Metallic wires 14 and 15 consist of aluminum wires, or the like, and for the metallic wire 14, one end is bonded to the exposed part of the inner connection 12a of the electrode terminal 12, and the other end is bonded to a conductor 3. Moreover, for the other metallic wire 15, one end is bonded to the exposed part of the inner connection 13a of the electrode terminal 13, and the other end is bonded onto a semiconductor chip 1. That is, this is of structure where the electrode terminals 12 and 13 are connected to the case 11, and the electrode terminals 12 and 13 and an insulating substrate 2 are connected by the metallic wires 14 and 15 alone. |
