发明名称 FORMING METHOD OF APERTURE PART FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To reduce NG in alignment process, and improve the precision of mask alignment, by a method wherein a step-wise step-difference is formed by interrupting halfway etching of third exposing process and developing process, and repeating this. CONSTITUTION:For third exposing process, a pattern larger than the size at the time of second exposure is subjected to alignment exposure by using an alignment mark 15 formed by second exposing process, and developing and etching are repeated. At this time, since the size of an image pattern formed by first exposure is not changed, the alignment mark 15 is intermittently etched. It is possible to repeat the same process n-times, but the process is repeated, e.g. 3-times, thereby forming a step-wise step-difference in an aperture part 14. The side wall of the mark 15 is formed in a pattern having a vertical profile.
申请公布号 JPH0334423(A) 申请公布日期 1991.02.14
申请号 JP19890169053 申请日期 1989.06.30
申请人 TOSHIBA CORP 发明人 TSUJI HITOSHI;HARAGUCHI HIROSHI
分类号 H01L21/302;H01L21/027;H01L21/30;H01L21/3065;H01L21/3205;H01L21/768 主分类号 H01L21/302
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