| 摘要 |
PURPOSE:To improve efficiency in connecting work by connecting a bumpless bear chip to a film circuit board wherein an insulating material for an LSI connecting part is removed and an opening part is provided with a wedge bonder. CONSTITUTION:An aluminum laminated insulating film 10 is etched, and a circuit pattern is formed. The insulating material for an LSI connecting part is removed, and an opening part 11 is provided. Thus, a film circuit base is formed. Then, a wedge bonder bead 50 is inserted into the opening part 11. An aluminum lead pattern 20 and a chip pad 31 are sequentially connected. Thereafter, the entire LSI bear chip 30 is molded, and a molded part 40 is formed. Therefore, a bum step is omitted, and only one connecting part is enough. Since the aluminum lead pattern is directly connected to the pad for the LSI bear chip, wire is not required. Therefore, the connecting speed becomes quick, and the working efficiency can be improved. |
