发明名称 Dry etching method
摘要 An article to be etched is contacted with a plasma of a mixed gas containing an etching gas and a film forming gas or a surface modification gas at a low temperature to effect the dry etching of the article, whereby the selectivity of etching can be made very high and the inclination angle of the side wall of pattern can be controlled at a desired level.
申请公布号 US4992136(A) 申请公布日期 1991.02.12
申请号 US19880223570 申请日期 1988.07.25
申请人 HITACHI, LTD. 发明人 TACHI, SHINICHI;TSUJIMOTO, KAZUNORI;OKUDAIRA, SADAYUKI
分类号 H01L21/302;H01L21/306;H01L21/3065;H01L21/311;H01L21/3213 主分类号 H01L21/302
代理机构 代理人
主权项
地址