| 摘要 |
PURPOSE: To surely bond lead ends to pads by coating pad connecting regions with solder and irradiating a laser beam on exposed regions of pads to temporarily heat at specified temp. CONSTITUTION: Circuit components have arranged flat wire leads or terminals 24 and leads 24 having vertical legs 24a and ends 24b, the ends 24b grounded onto solder pads 26 at corresponding positions of a printed circuit 22. To couple the ends 24b to the pads 26, they are coated with solder, and a laser beam is irradiated for a time on exposed regions of the pads 26 to heat the pads above the solder m.p. but below the pad m.p., owing to the heat conduction through the solder to bond the leads 24 where the pads 26 are partly exposed from the leads 24 to thereby surely bond, using a molten solder having a high thermal conductivity. |
