Characteristic impedance-correct chip carrier for microwave semiconductor components

摘要

In a chip carrier for microwave components with an electrically conductive support and with a dielectric substrate, the electrical leads should be able to be impedance-matched in a simple manner. Such a chip carrier should be easy to insert in a microwave circuit and should have a simple construction. A recess (3) in the dielectric substrate (1) is in shape and size to the microwave component(s) to be mounted. The dielectric substrate (1) rests on the electrically conductive support (2). At least one microwave semiconductor component (4) is inserted in the recess (3) of the dielectric substrate (1). The ground terminals (11) of the microwave semiconductor component (4) are connected with the support (2) inside the recess (3). In the connection surface between the dielectric substrate (1) and support (2), the substrate (1) protrudes beyond the support (2). Where the substrate (1) protrudes beyond the support (2), the microwave strip lines (5) applied on the upper surface of the substrate (1) have thickened sections (6) for electrical connection to other materials.