| 摘要 |
<p>The invention relates to the encapsulating of integrated circuits in multi-layer ceramic packages. In order to house power-supply decoupling capacitors (connected for example between the power supply lines at zero volt potential and the lines at 2 volts or 5 volts potential), while limiting as far as possible the bulk and cost of the package, there is provision for the capacitors to be individual capacitors 20 inserted into blind housings 18 in the rear of the package instead of being integrated capacitors in the form of multilayer ceramics in the cover of the package. The electrodes of the upper part of the package come into contact with contact regions in the bottom of the housings, these contact regions forming part of one of the interconnection layers inside the multilayer package. <IMAGE></p> |
