METHOD FOR INJECTING WATER INTO TRENCH OF SEMICONDUCTOR WAFER AND SEMICONDUCTOR-WAFER TREATING APPARATUS USED IN THE SAME METHOD,申请号JP19890164764-传众专利搜索

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发明名称	METHOD FOR INJECTING WATER INTO TRENCH OF SEMICONDUCTOR WAFER AND SEMICONDUCTOR-WAFER TREATING APPARATUS USED IN THE SAME METHOD
摘要
申请公布号	JPH0330328(A)	申请公布日期	1991.02.08
申请号	JP19890164764	申请日期	1989.06.27
申请人	MITSUBISHI ELECTRIC CORP	发明人	TESHIGAHARA HITOSHI;KOTO SATORU
分类号	H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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