| 摘要 |
<p>PURPOSE:To make it possible to decrease the time to be needed for a bonding work by a method wherein bonding connections of two places or more are simultaneously executed using two pieces or more of multibonding blocks, the intervals between the bonding heads of which are variably adjusted. CONSTITUTION:In case bonding pads 301 to 308,... of an LSI chip 3 and lead frames 201 to 208,... are connected to each other by bonding wires 4, bonding connections of two places or more are simultaneously executed using two pieces or more of multibonding blocks 11 and 12, the intervals Bx and By between bonding heads 11a and 11b and 12a and 12b of which are variably adjusted corresponding to the pitch between two pieces of the adjacent bonding pads and the pitch between two pieces of the adjacent lead frames. For example, bonding heads 11a and 11b and 12a and 12b are respectively brought into contact to lead frames 201 and 202 and bonding pads 305 and 306 to bond one end of each wire 4, then, the wires 4 are connected to bonding pads 301 and 302 and the lead frames 205 and 206.</p> |
