| 摘要 |
PURPOSE:To contrive the simplification of the assembly process of a semiconductor laser by a method wherein a laser diode(LD) chip and a photodiode(PD) chip are assembled on a plane of a submount. CONSTITUTION:A face light emission type LD chip 1 is used and the chip 1 and a PD chip 4 are die bonded on a plane of a submount 2 incorporated in a stem 5. After this, each electrode of the chips 1 and 4 is wire bonded with each lead post 7 and a cap 8 mounted with a hologram lens 9 is installed. In this case, an emitting light from the chip 1 passes through the lens 9 to act as a light source of an optical system and a return light comes again into the lens 9, but the return light comes returning at an angle to an incident light. Therefore, by keeping the chip 4 die-bonded at the position of the return light, the good optical coupling of the return light with the monitoring PD chip can be obtained. In such a way, as the chips 1 and 4 are assembles on the same plane, die bonding and wire bonding processes can be simplified.
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