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发明名称
MOUNTING OF SEMICONDUCTOR CHIP
摘要
申请公布号
JPH0330446(A)
申请公布日期
1991.02.08
申请号
JP19890165821
申请日期
1989.06.28
申请人
RICOH CO LTD
发明人
TADAISHI EIJI
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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