Soldering system for circuit board surface mounted devices - has solder frame for simultaneous soldering of circuit-mounted devices and edge connector contact tongues

摘要

The soldering system uses a solder frame supporting the circuit boards (1) with the attached surface mounted devices (2), before the frame is lapped by a solder wave. Each of the circuit boards (1) has an edge connector provided by contact tongues attached to a carrier strip (4). The circuit boards (1) are supported by the solder frame (10) so that the solder wave simultaneously solders the surface-mounted devices (2) and the contact tongues of the edge connector. Pref. the circuit boards (1) are supported between spaced longitudinal rails (14) of the rectangular solder frame via the edge connector carrier strip (4) and the opposing edge of the circuit board (1). ADVANTAGE - Simultaneous soldering of circuit mounted devices and edge connector.