| 摘要 |
PURPOSE:To arrange that an exposed part of bonding pads is not left after a bonding operation and to enhance a bonding strength by a method wherein the bonding pads are formed of a plurality of metal interconnection layers which have been arranged in ring shapes which are smaller than a part where a bonding wire is bonded actually. CONSTITUTION:Bonding pads of a semiconductor integrated circuit device are formed of a plurality of metal interconnection layers 4 which have been arranged in ring shapes which are smaller than a part which is actually bonded. That is to say, after the bonding pads 4 have been bonded by using a bonding wire 5, the bonding pads 4 are formed so as to be covered completely with the bonding wire 5. Thereby, an exposed part of the bonding pads 4 can be eliminated after this bonding operation; the moisture-resistance is enhanced; the bonding pads 4 are connected so as to be intruded into the bonding wire 5; as a result, its bonding strength can be enhanced. |
