Electronic circuit substrate.

摘要

An electronic circuit substrate excellent in reliability, which comprises: a porous ceramic sintered body (1) with film devices such as a conductive circuit (12), a resistor (13) and a capacitor directly formed on the surface thereof; and a resin (4) filled in the pores of the porous ceramic sintered body; the bottom surface of the film devices being fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate, which comprises the steps of: forming film devices directly on a surface of a porous ceramic sintered body; and filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state.