| 摘要 |
PURPOSE:To eliminate the production of a thermal stress of a cooler by face- down bonding a semiconductor chip to a substrate mounted on a housing and bonding the back surface of this chip through a metal film to a flexible thermal conduction plate with low melting point metal. CONSTITUTION:A semiconductor chip 4 is face-downward bonded with a solder ball 9 on a substrate 8 to bond the substrate 8 to a housing 1 (numeral 13 designates a cooler), a metal film is formed on the back surface of a semiconductor chip, while a flexible thermal conduction plate 10 and a thermal conduction plate 11 having a gap are provided at the housing 1, and the plate 11 and the chip 4 are bonded through a low melting point metal 12. In this manner, since the chip and the housing can be completely bonded, an electronic device having compact structure and high reliability can be obtained. |
