发明名称 LIGHT-RECEIVING ELEMENT, ELECTRONIC CIRCUIT BOARD LIGHT-RECEIVING FRAME, AND THEIR MANUFACTURING METHOD
摘要 PURPOSE:To improve adhesion properties and air-tightness between a light- receiving frame and a transparent resin by adhering the light-receiving frame and the transparent resin with a rubber epoxy resin using an engineering plastic for the light-receiving frame. CONSTITUTION:A light-receiving frame 5 used for a light-receiving element 1 is made by forming an engineering plastic and the light-receiving frame 5 and a transparent resin 4 are adhered by a rubber epoxy resin 6 which is adhered to the surface of the light-receiving frame 5. Thus, even after heating at high temperature with a reflow furnace, etc., the adhesion and air-tightness between the light-receiving frame 5 of the light-receiving element 1 and the transparent resin 4 are maintained, and the light-receiving element 1 is not contaminated through such process as cleaning, thus preventing a product quality from being deteriorated due to contamination.
申请公布号 JPH0327554(A) 申请公布日期 1991.02.05
申请号 JP19890131132 申请日期 1989.05.24
申请人 MORIRIKA:KK 发明人 SHIMODA KIMIMASA;YAMAGUCHI HIROSHI
分类号 H01L21/56;H01L23/02;H01L31/02 主分类号 H01L21/56
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