Chip card structure

摘要

Disclosed is a method for the fabrication of chip cards. These cards are flat and undergo a high degree of deformation under bending and twisting stresses, when the user does not take any special precautions in their use. A micromodule is housed in a cavity of the card, and this micromodule is fixed by the natural adhesion between the plastic material of the bottom of the cavity and the coating resin of the integrated circuit of the module. To prevent the micromodule from being torn off during a bending stress undergone by the card, there is provision for at least one overhang by which the upper surface of the card covers an edge of the micromodule to limit the movements of said micromodule.