| 摘要 |
<p>PURPOSE:To prevent short-circuiting due to loose bonding wire and to miniaturize a package by arranging inner leads in positions higher than the plane position where a lead frame is mounted adhering a semiconductor device. CONSTITUTION:The plane position of each inner lead 3 is set in a higher position than the surface height of a semiconductor device 1 which is mounted to a mounting part 2 by forming one part of an external lead 4 connected to the inner lead 3 upward with bending or by forming the outer lead 4 connected to the mounting part 2 downward with bending. This configuration prevents bonding wires 5 from contacting the edge part or the mounting part 2 of the semiconductor device 1 even if the bonding wire 5 becomes loose and allows sufficient dimensions to be secured between both even if the dimensions between planes of the inner lead 3 is reduced for the mounting part 2, thus miniaturizing the package.</p> |
