| 摘要 |
PURPOSE:To substantially improve the productivity of grinding process handling wafer processed wafers having high added value by controlling the rotary speed of a supporting table by means of a surface roughness measuring means. CONSTITUTION:The grinding surfaces of wafers 3 are monitored by a surface roughness measuring means 5 to control the rotary speed of a table 4 supporting wafers 3, i.e., the grinding time of each wafer according to the resulted evaluation. If grinding teeth 6 is deteriorated in grinding ability causing the problems due to the deterioration of brightness of the surface having been ground or plucking phenomenon, the rotary speed of the table 4, i.e., the speed of wafers 3 rotating on a multi-spindle grinding device 2 is automatically reduced to the slow speed set beforehand. |
