| 摘要 |
PURPOSE:To extend an inner lead within a sealing resin, enhance supporting strength of the inner leads, and prevent their separation by forming one part of the inner leads longer so that it overlaps with a semiconductor chip. CONSTITUTION:A chip 7 is mounted to a lead frame 1. A plurality of bonding pads 8 are placed at the edge part of the chip 7 and are placed on an epoxy resin 6 which is provided at the middle part of an inner lead 3 with the rear surface being in contact and being supported by the resin at multiple points. After that, heating treatment is performed, the resin 6 is cured, and the adhesion force allows the chip 7 to be adhered onto the middle part of the inner lead 3. Then, the pads 8 and a bonding part 3a are connected by a wire 9. After that, these are resin-sealed, tie-bars 5 and a frame 2 are cut off, and external leads 4 are subjected to bending to complete a device. |
