| 摘要 |
PURPOSE:To improve separation between a wire and a capillary at the time of wire bonding and improve transmission efficiency of supersonic oscillation by making an inner wall at the tip of a cone tiered. CONSTITUTION:When a wire 2 is pushed against a semiconductor device 3 via a capillary 1, if vertical displacement occurs on the capillary 1 due to the impact, or if vertical displacement occurs on the device 3, the oscillation can be received at shoulder height (d) with supersonic oscillation (c) applied to the capillary 1, if a resulted slit (b) is equal to or shorter than a wire holding part 1a. Thus oscillation can be efficiently transmitted to a junction face 4 with the device 3, Therefore constantly stable and highly reliable bonding is possible. |
