| 摘要 |
PURPOSE:To prevent moisture resistance of a transparent resin sealing layer from being deteriorated by coating the surface of the transparent resin sealing layer with a second protection film consisting of a moisture-resistant material. CONSTITUTION:After coating an optical semiconductor device chip 2 which is mounted on a die stage 1, the surface of a wire 4 bonded to the chip 2 and the lower surface of the die stage 1 with a first protection film 5 and then sealing it into a transparent resin layer 6, the surface of the transparent resin layer 6 is coated with a second insulating film 7 consisting of a moisture- resistant material, thus preventing cracks from occurring at the transparent resin layer 6 and a moisture resistance from being deteriorated. |
