| 摘要 |
PURPOSE:To prevent a lead from being pulled out and improve moisture resistance by curving one part of a lead within a sealed resin. CONSTITUTION:One part of a lead frame 1a of leads 3a-3d connected to a semiconductor device electrically with a metal thin wire is curved for forming a curved part 3a' and for resin-sealing. This curving machining prevents a lead from a being pulled out without reducing the area of connection areas 7a-7d of the metal thin wire or the area of semiconductor device mounting parts 8a-8d and extends the leak path at the interface between a sealing resin 6a and the leads 3a-3d, thus improving moisture resistance against water and impurities entering the device. |
